Huawei’s Ascend P8 Metallic Case Shows Up In Live Pictures
A pretty attractive smartphone that was released this year is also the Huawei Ascend P7, device that arrive at a good price on the market. As expected, the Chinese company plans to launch next year a succesor called Ascend P8, phone that could be released at CES 2015 or later in March at MWC.
Through some pictures arrived recently on the web we can take a look on Huawei’s Ascend P8 metallic case, component that unveils the placement of the camera photo sensor and those of the SIM card and microSD card slot. Even if some rumors suggest that Ascend P8 will bring a 5.2-inch FHD display, this case from the picture above seems to be designed for a bigger panel.
Also, some leaks suggest that Huawei Ascend P8 will arrive with an octa-core HiSilicon Kirin 930 processor built on 16 nm. If these specs will be found on the new Ascend P8 smartphone remains to see.