Sony Xperia Z5 Premium Gets Dissected, Dual Heat Pipe Cooling Revealed, Together With Thermal Paste
Sony Xperia Z5 Premium has been launched with great fanfare this week at IFA 2015, with everyone talking about how nice its 4K display looks. The CPU choice doesn’t seem very inspired, especially since the Snapdragon 810 got a bad rep this year. However, cooling seems to be the key to make this combo work, as revealed by a recent teardown.
Somehow a source in China got its hands on the Sony Xperia Z5 Premium and dissected it, as shown in the image above. This 4K display smartphone (the first of its kind) seems to rely on two cooling solutions: a dual heat pipe cooling and thermal paste. The Snapdragon 810 is famous for overheating and throttling issues, but OnePlus put a stop to that by using a superior version of that chip.
Sony claims they’ve also fixed all potential issues. We can’t guarantee the image above is 100% real, but it does look plausible. The dual cooling heat pipe kind of looks added on after the whole device was designed and prototyped. With a 4K screen on board and S810 chip, I’m sure that temperatures would have been wild, without this solution. Heat pipes are commonly used in PCs, relying on a special liquid or substance to make the hot air circulate in a better way. I’m very curious about how this system works on a handset.