A purported preproduction HONOR Magic9 Pro Max has appeared on Geekbench, offering an early, but inconclusive, look at the flagship's hardware. The listing identifies 16GB of RAM, Android 17 and a Qualcomm chipset carrying the SM8975 code.
- Geekbench score: 3,448 points in single-core and 9,353 points in multi-core testing.
- Memory: 16GB of RAM.
- Software: Android 17.
The SM8975 chip is reportedly the Snapdragon 8 Elite Gen 6 Pro, a platform said in leaks to use a 2+3+3 CPU-core configuration. Neither the chipset name nor the benchmark results have been confirmed by HONOR, and performance figures from preproduction hardware can change as software and firmware are finalized.
HONOR has already confirmed the Magic9 Pro Max design and a 200MP periscope camera. Its large rear camera module also carries ARRI branding, reflecting a collaboration that HONOR is using to emphasize the phone's imaging and video credentials.
The company is preparing LogC3 support and production-oriented monitoring tools for video capture. HONOR has also released camera samples taken with the zoom system and dedicated teleconverters, including images at very long equivalent focal lengths. Those company-provided samples are not a substitute for independent camera testing, but they point to a photo- and video-focused positioning for the Pro Max model.
Earlier reports have suggested the handset could feature two 200MP cameras, a large battery and MagicOS 11, though those details remain unverified. HONOR is scheduled to launch the Magic9 Pro Max in China on September 28, when the final specifications and wider-market availability should become clearer.
