TSMC has some serious work to do, as it has been contracted by Apple to deliver its 10 nm chipset next year and now by Huawei to also make its next gen HiSilicon Kirin CPU. It’s the Kirin 970, based on TSMC tech and rivalling the latest Snapdragon, Exynos and MediaTek chips.
The 10 nm Kirin 970 should be ready around next fall, perhaps for the Huawei Mate 10. It’ll go against the Qualcomm Snapdragon 835, developed with the aid of Samsung’s 10 nm tech, plus the MediaTek Helio X30 also with 10 nm tech. Samsung already started production of 10 nm chips and they probably also have their own Exynos version of it.
Intel is expected to also get on board in Q3 2017, first with a trial production of 10 nm chips. Kirin 970 is going to be an octa core CPU, with 4 ARM Cortex A73 cores and 4 ARM Cortex A53 cores. LTE Category 12 will be supported and there will be a performance bump from the 16 nm Kirin 960, as well as lower consumption.