Xiaomi may source LPDDR6 memory for the upcoming Xiaomi 18 Fold from both China’s CXMT and SK hynix, rather than relying solely on CXMT. The dual-supplier approach is said to address limited early production capacity for CXMT’s newly mass-produced memory chips.
According to Digital Chat Station, Xiaomi plans to use components from both suppliers to avoid a memory shortage affecting the foldable’s initial production. That would not change the 18 Fold’s status as the first confirmed commercial smartphone to use CXMT LPDDR6 memory, but it suggests that not every unit will necessarily carry RAM from the same manufacturer.
CXMT’s LPDDR6 entered mass production with claimed speeds of up to 12,800 Mbps and capacities of up to 16 GB per chip. The higher bandwidth is increasingly relevant for on-device AI workloads and integrated graphics, both of which place heavier demands on communication between a processor and system memory.
The Xiaomi 18 Fold is also expected to use Xiaomi’s in-house XRING O3 processor. Xiaomi has cited bandwidth of up to 113.8 GB/s for the XRING O3 and LPDDR6 configuration, and says it established a joint laboratory with CXMT in 2022. The companies reportedly spent around a year tuning the platform for LPDDR6.
Xiaomi is scheduled to present the 18 Fold on September 7 alongside other XRING O3-based products. The foldable is expected to move to a wider design than the MIX Fold line, with a 7.58-inch internal display, a 6,000 mAh battery and Leica-branded cameras. The final split between CXMT and SK hynix memory in retail devices remains unconfirmed.
