Since mobile device processors have become powerful enough to put to shame netbooks these days, it’s safe to say that overheating is a problem. That’s why device makers and component manufacturers are looking into solutions to reduce temperature.
Fujitsu is at the forefront of this battle, launching a cooling solution based on steam chambers and heat pipes. Heat pipes are already available on some tablets and phones, as miniature copper tubes filled with a fluid that removes heat from the SoC. They are used to move heat around the unit and prevent the CPU from overheating. The fluid will vaporize the hottest point through the heat pipe and condense at the coldest point.
Then the fluid becomes a liquid and everything happens again. The Fujitsu solution offers a heat dissipation capability that’s 5 times higher than the rival solutions. The steam chamber they implemented has a bigger dissipation surface, sits on the SoC and allows gases to condense and return to liquid states. The liquid enters the steam chamber via a heat pipe and the system involves a loop.
Fujitsu’s invention has the advantage of being very compact, with a thickness of 0.6 mm for the steam room and 1 mm for the condenser plate.