Huawei isn’t only having a busy fall when it comes to handset launches, but they’re also prepping their brand new chipset. The HiSilicon Kirin 950 has been previously rumored and even said to be powerful enough to compete with the Mediatek Helio X20 and Snapdragon 820. Today we learn more about this powerhouse.


Apparently Huawei worked with TSMC on this project and created a chip based on 16 nm tech. The Kirin 950 is expected to power the future Huawei flagships and it brings a quad core A72 2.5 GHz group, plus a quad core A53 1.5 GHz setup and a Mali T880 MP6 GPU. We’re also getting 64 bit dual channel LPDDR4 memory support, up to 42 megapixel image processing, native 10 bit 4K H.265/VP9 codec and UFS 2.0 eMMC 5.1 storage support.


USB 3.0 is also here, plus Bluetooth 4.2 Smart, UFS 2.0, the i7 Coprocessor and MU MIMO WiFi. Interestingly, there will also be a lighter version, the HiSilicon Kirin 940, with A72 cores clocked at 2.2 GHz, Mali T860 GPU and LTE Cat 7. The camera support goes down to 32 MP. Huawei Honor 7 Plus is expected to pack one of these chipsets.